Pasta termica Thermaltake TG-50 4G
Producător:
THERMALTAKE
- Destinate pentru:Охлаждащи системи
- X-ka 2:TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
- X-ka 3:With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.
- X-ka 4:Density: 2.9 g/cm3
- X-ka 5:Viscosity: 47 Pa-s
- X-ka 6:Thermal impedance: 0.035°C -in2/W
- X-ka 7:Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
- X-ka 8:This thermal compound application kit includes a set of easily-applied tools for immediate use.