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Pasta termica Thermaltake TG-30 4G

Cod:
CL-O023-GROSGM-A
Producător:
Preț 5109Lei
Îmi doresc
  • 0.053 Kg
  • Destinate pentru:
    Охлаждащи системи
  • X-ka 2:
    TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
  • X-ka 3:
    The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
  • X-ka 4:
    Density: 2.55 g/cm3
  • X-ka 5:
    Viscosity: 76 Pa-s
  • X-ka 6:
    Thermal impedance: 0.185°C -in2/W
  • X-ka 7:
    Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
  • X-ka 8:
    The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.